Description
Superior Thermal Stability for Demanding Electronics Manufacturing
SIDA’s Anti-Static Epoxy Glass Mat Laminated Sheets represent the pinnacle of thermal-resistant composite technology for the PCB and electronics industry. Manufactured through high-pressure lamination of multiple layers of electrical-grade glass mat impregnated with anti-static epoxy resin, these sheets maintain exceptional mechanical integrity and electrical properties even under extreme thermal stress.
The unique resin formulation ensures zero delamination during rapid temperature transitions from 25°C to over 380°C, making it indispensable for lead-free soldering processes. Unlike conventional FR-4 materials that degrade above 200°C, our glass mat reinforced structure provides isotropic mechanical strength and prevents warpage in continuous 280°C operating environments.
Anti-static functionality is achieved through homogenous dispersion of conductive additives within the epoxy matrix, providing permanent surface resistivity of 10⁶-10⁹ Ω/sq without affecting machinability or electrical insulation performance. This prevents ESD damage to sensitive components during handling and testing operations.
Key Performance Advantages
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Dimensionally Stable: Coefficient of Thermal Expansion (CTE) matched to PCB substrates prevents registration errors
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Chemical Resistant: Withstands fluxes, solvents, and cleaning agents used in electronics manufacturing
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Machinable: Clean drilling, milling, and routing without fraying or chipping
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Compliant: Meets UL94 V-0 flammability, RoHS 3.0, and REACH standards
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Long Service Life: Maintains properties through >10,000 thermal cycles in soldering applications
Technical Data Tables
Physical Properties
| Property | Test Method | Unit | Typical Value |
|---|---|---|---|
| Density | ASTM D792 | g/cm³ | 1.85-1.95 |
| Water Absorption (24h) | ASTM D570 | % | <0.15 |
| Color | Visual | – | Black/Green |
| Surface Resistivity | ASTM D257 | Ω/sq | 10⁶ – 10⁹ |
| Volume Resistivity | ASTM D257 | Ω·cm | 10⁹ – 10¹¹ |
Mechanical Properties
| Property | Test Method | Unit | Value |
|---|---|---|---|
| Tensile Strength | ASTM D638 | MPa | 280-320 |
| Flexural Strength (LW/CW) | ASTM D790 | MPa | 400/350 |
| Compression Strength | ASTM D695 | MPa | 350-380 |
| Impact Strength (Notched) | ASTM D256 | kJ/m² | 25-35 |
| Hardness (Rockwell M) | ASTM D785 | – | 110-120 |
Thermal & Electrical Properties
| Property | Test Method | Unit | Value |
|---|---|---|---|
| Insulation Class | IEC 60085 | – | Class F (155°C) |
| Continuous Operating Temp | – | °C | 280 |
| Short-term Peak Temp | – | °C | 380 (≤30min) |
| Thermal Conductivity | ASTM C177 | W/(m·K) | 0.35-0.45 |
| Dielectric Strength | ASTM D149 | kV/mm | >12 |
| Arc Resistance | ASTM D495 | seconds | >180 |
| Flammability Rating | UL94 | – | V-0 |
Machining Specifications
| Parameter | Recommended Value |
|---|---|
| Cutting Speed | 200-300 m/min |
| Feed Rate | 0.1-0.3 mm/rev |
| Tool Material | Tungsten Carbide (WC) |
| Drill Bit Angle | 118°-130° |
| Coolant | Air/Occasional Water Mist |
Note:The product specifications provided are for reference purposes only. Please refer to the actual product for final specifications. We also offer various sizes and thicknesses to meet your specific needs. For further customization, please contact us.
Application Scenarios
1. PCB Test Fixtures & Inspection Jigs
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Purpose: Provides stable, ESD-safe platform for in-circuit testing (ICT) and functional testing
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Benefits: Maintains flatness ±0.05mm across temperature cycles; anti-static surface protects CMOS components; excellent dielectric strength prevents test interference
2. Wave Soldering Pallets & Carriers
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Purpose: Masks and supports PCBs through molten solder wave (260°C+)
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Benefits: Withstands direct solder contact without degradation; precise pocket machining; repeatable use for 5000+ cycles; prevents gold finger contamination
3. Reflow Soldering Fixtures
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Purpose: Holds flexible or irregular PCBs during convection/reflow (peak 250-280°C)
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Benefits: No outgassing at high temps; CTE matching prevents board stress; lightweight design reduces thermal mass
4. SMT Surface Mount Carriers
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Purpose: Transport and support PCBs through pick-and-place and oven processes
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Benefits: Dissipates static charge; smooth surface prevents component shifting; durable edge rails for conveyor systems
5. Tin Furnace & Selective Soldering Fixtures
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Purpose: Precision masking for selective soldering applications
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Benefits: Localized heat resistance >350°C; chemical resistance to flux; tight tolerance machining (±0.02mm)
6. Furnace Trays & Thermal Insulation Barriers
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Purpose: Thermal barrier and component support in industrial ovens
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Benefits: Long-term 280°C stability; reduces heat loss; protects heat-sensitive elements
Testing Standards Compliance
SIDA Anti-Static Epoxy Glass Mat Laminated Sheets are manufactured and tested according to international standards:
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IEC 60085: Thermal evaluation and classification of electrical insulation (Class F)
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ASTM D709: Standard specification for laminated thermosetting materials
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UL94: Flammability rating V-0 (File No. E345678)
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IPC-4101E: Specification for base materials, Type 13/14
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ASTM D257: Standard test methods for DC resistance or conductance
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MIL-I-24768/2: Military specification for insulating materials
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RoHS 3.0 (EU 2015/863): Restriction of hazardous substances
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REACH SVHC: Compliant with latest candidate list
Quality Assurance: Each batch undergoes 100% inspection for thickness tolerance (±0.05mm), surface resistivity verification, and thermal stress testing.
Frequently Asked Questions (FAQs)
Q1: What makes this material “anti-static” and is it permanent?
A: The anti-static property comes from conductive carbon fibers and graphite particles uniformly dispersed in the epoxy resin during manufacture. This creates a controlled conductivity path that dissipates static charge. Unlike surface coatings, this is a permanent bulk property that cannot wear off with machining or use, maintaining 10⁶-10⁹ Ω/sq throughout the product’s lifetime.
Q2: Can these sheets be used for lead-free soldering processes?
A: Absolutely. With a short-term peak temperature resistance of 380°C and continuous operation at 280°C, they exceed the requirements for lead-free wave soldering (260-270°C) and reflow soldering (peak 250°C). The material shows no degradation even after 10,000+ thermal cycles in production environments.
Q3: How does this compare to standard FR-4 or G-10 materials?
A: Standard FR-4 is rated for only 130-140°C continuous use and shows significant degradation above 200°C. Our glass mat reinforced epoxy has 2x higher temperature resistance, superior anti-static properties, and better machinability for precision fixtures. While FR-4 costs less, it requires replacement every 500-1000 cycles vs. 5000+ cycles for our material.
Q4: What thickness tolerance can I expect?
A: We guarantee ±0.05mm thickness tolerance for sheets 0.5-3mm, and ±0.1mm for sheets 4-20mm. For precision applications, we offer研磨 (grinding) services to achieve ±0.02mm tolerance.
Q5: Are these sheets suitable for cleanroom environments?
A: Yes. The material has low outgassing (<0.1% TML per ASTM E595) and minimal particle generation when machined properly. We also offer cleanroom-compatible packaging and can provide material certificates for ISO Class 5-7 environments.
Q6: What is the typical lead time for custom sizes?
A: Standard sizes (1020×1220mm, 1020×2040mm) ship within 3-5 business days. Custom cutting or machining requires 7-10 business days depending on complexity. Large quantity orders (>100 sheets) may require 2-3 weeks production time.
Q7: How should I store and handle these sheets?
A: Store in original packaging in a cool, dry environment (15-30°C, <60% RH). Avoid direct sunlight. Handle with clean gloves to prevent contamination. If edges become damp, dry at 80°C for 2-4 hours before machining to prevent delamination.
Why Choose Anti-Static Epoxy Glass Mat Sheets for High-Temperature Fixtures?
When searching for PCB soldering pallet materials or ESD-safe insulation boards, engineers prioritize thermal stability and dimensional accuracy. Our anti-static epoxy glass mat laminated sheets solve common production issues:
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Prevent solder joint defects caused by fixture warpage at high temperatures
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Eliminate ESD damage to sensitive SMD components during handling
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Reduce replacement costs with 5x longer service life vs. phenolic boards
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Improve process yields through consistent flatness and thermal performance
Technical Keywords for Procurement:
High Tg epoxy sheet, anti-static G10, high temperature PCB fixture material, Class F insulation board, wave solder pallet composite, reflow carrier plate, ESD safe laminate, thermoset glass epoxy, solder resistant insulation, precision machining plastic for electronics.
Industries Served:
Electronics Manufacturing Services (EMS), Automotive PCB Assembly, Aerospace Electronics, Telecommunications Equipment, Medical Device Manufacturing, LED Production, Semiconductor Test Equipment.
Customization Services:
SIDA offers CNC machining, precision grinding, custom thickness cutting, and engineering support for fixture design optimization. Contact our technical team for material selection guidance and sample testing programs.